BE Semiconductor Industries (OTCMKTS:BESIY) Stock Price Passes Above 200-Day Moving Average – Here’s What Happened

BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report)’s share price passed above its two hundred day moving average during trading on Thursday . The stock has a two hundred day moving average of $168.38 and traded as high as $225.0150. BE Semiconductor Industries shares last traded at $218.00, with a volume of 7,451 shares traded.

Analysts Set New Price Targets

A number of analysts recently issued reports on BESIY shares. Sanford C. Bernstein reissued an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Citigroup reaffirmed a “neutral” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 20th. Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a research report on Monday, February 23rd. Kepler Capital Markets downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, January 9th. Finally, Needham & Company LLC upgraded shares of BE Semiconductor Industries to a “buy” rating in a research report on Tuesday, January 6th. Five research analysts have rated the stock with a Buy rating and six have given a Hold rating to the company’s stock. Based on data from MarketBeat.com, the stock has a consensus rating of “Hold”.

Get Our Latest Stock Report on BESIY

BE Semiconductor Industries Trading Down 17.4%

The company has a debt-to-equity ratio of 1.46, a current ratio of 5.75 and a quick ratio of 5.02. The stock has a 50-day moving average of $199.32 and a 200-day moving average of $168.67.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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