BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) saw a large growth in short interest during the month of October. As of October 15th, there was short interest totaling 2,511 shares, a growth of 423.1% from the September 30th total of 480 shares. Approximately 0.0% of the company’s shares are short sold. Based on an average daily volume of 25,823 shares, the days-to-cover ratio is currently 0.1 days.
BE Semiconductor Industries Trading Up 0.7%
OTCMKTS BESIY opened at $163.27 on Tuesday. BE Semiconductor Industries has a 12 month low of $140.07 and a 12 month high of $374.33. The stock has a 50-day simple moving average of $212.95 and a 200 day simple moving average of $246.25. The company has a current ratio of 4.28, a quick ratio of 3.73 and a debt-to-equity ratio of 0.60. The company has a market capitalization of $11.84 billion, a PE ratio of 53.53 and a beta of 1.99.
Wall Street Analysts Forecast Growth
BESIY has been the subject of a number of recent research reports. UBS Group downgraded shares of BE Semiconductor Industries from a “buy” rating to a “sell” rating in a research note on Wednesday, October 7th. Berenberg Bank upgraded shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a report on Tuesday, August 4th. Zacks Research cut shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, September 25th. Finally, Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, September 8th. One research analyst has rated the stock with a Strong Buy rating, four have issued a Buy rating, three have given a Hold rating and one has assigned a Sell rating to the company’s stock. According to MarketBeat.com, BE Semiconductor Industries currently has a consensus rating of “Moderate Buy”.
View Our Latest Report on BE Semiconductor Industries
About BE Semiconductor Industries
BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.
BESI’s product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.
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