BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Up – Still a Buy?

BE Semiconductor Industries NV (OTCMKTS:BESIY)’s stock price gapped up before the market opened on Tuesday. The stock had previously closed at $163.30, but opened at $178.87. BE Semiconductor Industries shares last traded at $179.33, with a volume of 1,535 shares changing hands.

Wall Street Analyst Weigh In

A number of equities research analysts have issued reports on BESIY shares. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, September 8th. Berenberg Bank upgraded shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a report on Tuesday, August 4th. UBS Group downgraded shares of BE Semiconductor Industries from a “buy” rating to a “sell” rating in a research note on Wednesday, October 7th. Finally, Zacks Research lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, September 25th. One equities research analyst has rated the stock with a Strong Buy rating, four have given a Buy rating, three have assigned a Hold rating and one has issued a Sell rating to the company. According to data from MarketBeat.com, the company presently has an average rating of “Moderate Buy”.

BE Semiconductor Industries Stock Down 0.6%

The company has a debt-to-equity ratio of 0.60, a current ratio of 4.28 and a quick ratio of 3.73. The firm has a market capitalization of $13.20 billion, a P/E ratio of 43.33 and a beta of 1.99. The business has a 50 day moving average price of $209.60 and a 200 day moving average price of $246.29.

About BE Semiconductor Industries

BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.

BESI’s product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.