Disco (OTCMKTS:DSCSY) Shares Gap Down – What’s Next?

Disco Corp (OTCMKTS:DSCSY)’s stock price gapped down prior to trading on Thursday. The stock had previously closed at $34.65, but opened at $33.01. Disco shares last traded at $33.4950, with a volume of 1,144 shares changing hands.

Analyst Ratings Changes

Separately, Jefferies Financial Group raised Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. One equities research analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company’s stock. According to data from MarketBeat, Disco has a consensus rating of “Moderate Buy”.

Disco Price Performance

The company has a 50-day simple moving average of $36.67 and a 200-day simple moving average of $42.02. The stock has a market cap of $37.63 billion, a PE ratio of 39.86 and a beta of 1.54.

Disco (OTCMKTS:DSCSY) last issued its earnings results on Thursday, July 23rd. The company reported $0.20 EPS for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. The company had revenue of $717.28 million for the quarter. On average, equities analysts expect that Disco Corp will post 1.11 EPS for the current fiscal year.

Institutional Trading of Disco

An institutional investor recently bought a new stake in Disco stock. Azimuth Capital Investment Management LLC bought a new position in shares of Disco Corp (OTCMKTS:DSCSY) during the 2nd quarter, according to its most recent 13F filing with the Securities and Exchange Commission (SEC). The institutional investor bought 237,250 shares of the company’s stock, valued at approximately $11,862,000. 0.03% of the stock is owned by institutional investors and hedge funds.

About Disco

DISCO Corporation, traded in the United States under the symbol DSCSY, is a Japanese manufacturer of precision processing equipment and tools used primarily in semiconductor and electronic-component production. The company develops technologies for cutting, grinding and polishing hard, brittle materials such as silicon, compound semiconductors, glass and ceramics.

Its product portfolio includes wafer-dicing saws, grinding and polishing systems, laser-based processing equipment, and the consumable blades, wheels and other tools used with those machines.