Disco (OTCMKTS:DSCSY) Stock Price Down 8.8% – Should You Sell?

Disco Corp (OTCMKTS:DSCSYGet Free Report) shares were down 8.8% during trading on Wednesday . The company traded as low as $47.76 and last traded at $47.76. 676,463 shares traded hands during mid-day trading, an increase of 131% from the average session volume of 293,226 shares. The stock had previously closed at $52.37.

Analyst Ratings Changes

Separately, Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has given a Hold rating to the company’s stock. According to data from MarketBeat.com, the stock currently has an average rating of “Buy”.

Read Our Latest Stock Report on DSCSY

Disco Price Performance

The stock has a market cap of $51.81 billion, a PE ratio of 58.24 and a beta of 1.54. The business has a 50 day moving average price of $46.38 and a two-hundred day moving average price of $42.73.

Disco (OTCMKTS:DSCSYGet Free Report) last posted its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The business had revenue of $848.13 million during the quarter, compared to the consensus estimate of $771.53 million. On average, sell-side analysts forecast that Disco Corp will post 1.05 earnings per share for the current fiscal year.

About Disco

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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