BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) was the recipient of a large decline in short interest in the month of May. As of May 29th, there was short interest totaling 2,987 shares, a decline of 60.3% from the May 14th total of 7,533 shares. Currently, 0.0% of the shares of the company are sold short. Based on an average daily volume of 15,090 shares, the short-interest ratio is currently 0.2 days.
BE Semiconductor Industries Price Performance
Shares of OTCMKTS BESIY traded down $2.94 during midday trading on Friday, reaching $365.70. The company’s stock had a trading volume of 6,669 shares, compared to its average volume of 6,931. The company has a current ratio of 4.74, a quick ratio of 4.17 and a debt-to-equity ratio of 1.11. The company has a 50 day moving average price of $294.91 and a 200 day moving average price of $226.46. BE Semiconductor Industries has a one year low of $122.81 and a one year high of $368.93. The company has a market cap of $26.52 billion, a price-to-earnings ratio of 165.48 and a beta of 1.97.
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its earnings results on Thursday, April 23rd. The technology company reported $0.76 EPS for the quarter, hitting analysts’ consensus estimates of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The business had revenue of $216.51 million for the quarter, compared to the consensus estimate of $220.77 million. On average, equities research analysts expect that BE Semiconductor Industries will post 4.46 EPS for the current year.
Analyst Ratings Changes
Read Our Latest Research Report on BESIY
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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