SEI High Yield Bond & Alternative Credit ETF (LEND) To Go Ex-Dividend on November 4th

SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) declared a monthly dividend on Tuesday, November 3rd. Investors of record on Wednesday, November 4th will be paid a dividend of $0.1535 per share on Thursday, November 5th. This represents a $1.84 annualized dividend and a yield of 7.6%. The ex-dividend date is Wednesday, November 4th. This is a 14.3% increase from SEI High Yield Bond & Alternative Credit ETF’s previous monthly dividend of $0.1343.

SEI High Yield Bond & Alternative Credit ETF Stock Performance

NASDAQ:LEND opened at $24.14 on Thursday. The company’s 50-day moving average is $24.39 and its two-hundred day moving average is $21.33. SEI High Yield Bond & Alternative Credit ETF has a 12-month low of $23.95 and a 12-month high of $25.29.