BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price gapped up before the market opened on Thursday . The stock had previously closed at $336.84, but opened at $358.60. BE Semiconductor Industries shares last traded at $359.4375, with a volume of 743 shares.
Analyst Upgrades and Downgrades
A number of equities research analysts have issued reports on the stock. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. Zacks Research upgraded shares of BE Semiconductor Industries to a “strong-buy” rating in a research note on Thursday, April 23rd. Deutsche Bank Aktiengesellschaft reiterated a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Finally, Berenberg Bank upgraded shares of BE Semiconductor Industries to a “hold” rating in a research note on Monday, February 23rd. One equities research analyst has rated the stock with a Strong Buy rating, five have given a Buy rating and four have issued a Hold rating to the company’s stock. According to data from MarketBeat.com, the stock currently has a consensus rating of “Moderate Buy”.
View Our Latest Analysis on BE Semiconductor Industries
BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last announced its quarterly earnings data on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, hitting analysts’ consensus estimates of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The firm had revenue of $216.51 million for the quarter, compared to the consensus estimate of $220.77 million. On average, research analysts forecast that BE Semiconductor Industries NV will post 4.46 earnings per share for the current year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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