BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price hit a new 52-week high during trading on Tuesday . The company traded as high as $341.70 and last traded at $340.48, with a volume of 1678 shares traded. The stock had previously closed at $305.21.
Analyst Ratings Changes
BESIY has been the topic of a number of research analyst reports. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Zacks Research raised BE Semiconductor Industries to a “strong-buy” rating in a research report on Thursday, April 23rd. Finally, Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a research report on Monday, February 23rd. One analyst has rated the stock with a Strong Buy rating, five have assigned a Buy rating and four have given a Hold rating to the company. Based on data from MarketBeat.com, BE Semiconductor Industries currently has an average rating of “Moderate Buy”.
View Our Latest Research Report on BE Semiconductor Industries
BE Semiconductor Industries Stock Up 4.7%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last issued its quarterly earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, meeting the consensus estimate of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The firm had revenue of $216.51 million for the quarter, compared to analyst estimates of $220.77 million. Equities analysts expect that BE Semiconductor Industries NV will post 4.46 earnings per share for the current fiscal year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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