ChipMOS TECHNOLOGIES INC. (NASDAQ:IMOS – Get Free Report) was the recipient of a large decline in short interest in March. As of March 31st, there was short interest totalling 39,600 shares, a decline of 9.0% from the March 15th total of 43,500 shares. Based on an average daily volume of 25,500 shares, the days-to-cover ratio is presently 1.6 days.
Wall Street Analyst Weigh In
Separately, StockNews.com cut ChipMOS TECHNOLOGIES from a “strong-buy” rating to a “buy” rating in a research report on Thursday.
Check Out Our Latest Research Report on IMOS
Institutional Investors Weigh In On ChipMOS TECHNOLOGIES
ChipMOS TECHNOLOGIES Stock Performance
Shares of NASDAQ IMOS traded down $0.72 during midday trading on Monday, hitting $29.13. 11,222 shares of the stock traded hands, compared to its average volume of 23,686. The firm has a 50-day moving average of $29.56 and a two-hundred day moving average of $27.01. The firm has a market capitalization of $1.06 billion, a P/E ratio of 17.82 and a beta of 0.92. The company has a debt-to-equity ratio of 0.54, a quick ratio of 3.04 and a current ratio of 3.38. ChipMOS TECHNOLOGIES has a one year low of $21.58 and a one year high of $32.19.
ChipMOS TECHNOLOGIES (NASDAQ:IMOS – Get Free Report) last posted its quarterly earnings data on Thursday, February 22nd. The semiconductor company reported $0.43 EPS for the quarter, topping the consensus estimate of $0.42 by $0.01. The firm had revenue of $187.00 million during the quarter, compared to analyst estimates of $175.31 million. ChipMOS TECHNOLOGIES had a return on equity of 7.62% and a net margin of 8.85%. ChipMOS TECHNOLOGIES’s revenue was up 22.2% on a year-over-year basis. During the same period in the prior year, the business posted $0.22 EPS.
ChipMOS TECHNOLOGIES Company Profile
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in the People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments.
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